Our eUICC-enabled SIMs give you the confidence and flexibility to scale with ease.
Connect your devices worldwide with access to 500+ carriers in 200+ countries, ensuring they always pick up the strongest signal, no matter their location.
Choose from our Dual-Core and Single-Core SIMs to match your requirements for global carriers, high performance, or reliable back-up coverage.
Our Dual-Core SIMs feature two independent mobile cores, providing your business with dependable connectivity that prevents downtime backed by contractually guaranteed uptime SLAs.
Featuring two global networks, with roaming coverage from 500+ carriers in 200+ countries.
Connect to Tier-1 providers – Verizon in the US or TELUS in Canada – backed by a global roaming profile. These SIMS are designed for performance.
With roaming coverage from 400+ carriers in 200+ countries, these SIMs deliver comprehensive coverage for your global IoT devices.
Access low latency and high throughput connectivity for your high-data devices.
Confidently deploy devices with redundant, reliable coverage across 200+ countries and 500+ networks. SIMs automatically switch to the best available network, so you'll never notice if there's a weak signal or a downed tower. Access 2G, 3G, 4G LTE, 5G, LTE-M, and NB-IoT networks and gain automatic access to new network options as they become available.
View network coverageWith eUICC-enabled SIMs, cellular profiles are remotely swapped so you never have to touch hardware or replace SIMs. Keep track of these changing profiles — and more — directly in our dashboard.
Explore our DashboardHologram’s Dual-Core SIMs feature Fallback technology that detects when an outage event has occurred and switches to an alternative network or profile to get you back online within minutes.
View network coverageHarness our central hub for monitoring your fleet, featuring intuitive tools and deep analytics to support your team’s fleet operations. (Explore Hologram’s Dashboard and APIs).
Explore our dashboardOur global IoT SIMs are device agnostic. As long as your device is not set to work with a single carrier, it will work with Hologram. And if you have questions about compatibility, our team is standing by to help.
Our SIMs are available in both triple cut card and MFF2 embedded form factors.
Buy SIMsIdeal for most commercial applications and prototyping.
Built for harsh environments that require a longer life span.
The benefits of an industrial SIM secured to a physical device.
Triple cut form factor
Mini-SIM (2FF): 25 × 15 × 0.71 mm
Micro-SIM (3FF): 15 × 12 × 0.71 mm
Nano-SIM (4FF): 12.3 × 8.8 × 0.71 mm
Operating characteristics
Electrical: 1.6V, 3V and 5V
Operational temperature: -25ºC to +85ºC
Memory (NVM): 340K
4G (LTE), 3G, 2G, NB-IoT, LTE-M
Triple cut form factor
Mini-SIM (2FF): 25 × 15 × 0.71 mm
Micro-SIM (3FF): 15 × 12 × 0.71 mm
Nano-SIM (4FF): 12.3 × 8.8 × 0.71 mm
Operating characteristics
Electrical: 1.62V to 5.5V
Operational Temperature: -40ºC to +105ºC
Memory (NVM): 704 KB
4G (LTE), 3G, 2G, NB-IoT, LTE-M
Embedded SIM (eSIM) chip format
MFF2 (DFN8): 6 × 5 × 0.82mm
Operating characteristics
Electrical: 1.6V, 3V, and 5.5V
Operational temperature: -25ºC to +85ºC
Memory (NVM): 340 KB
4G (LTE), 3G, 2G, NB-IoT, LTE-M
Triple cut form factor
Mini-SIM (2FF): 25 × 15 × 0.71 mm
Micro-SIM (3FF): 15 × 12 × 0.71 mm
Nano-SIM (4FF): 12.3 × 8.8 × 0.71 mm
Operating characteristics
Electrical: 1.62V to 5.5V
Operational temperature: -25ºC to +85ºC
Memory (NVM): 704 KB
4G (LTE), 3G, 2G, NB-IoT, LTE-M
Triple cut form factor
Mini-SIM (2FF): 25 × 15 × 0.71 mm
Micro-SIM (3FF): 15 × 12 × 0.71 mm
Nano-SIM (4FF): 12.3 × 8.8 × 0.71 mm
Operating characteristics
Electrical: 1.62V to 5.5V
Operational Temperature: -40ºC to +105ºC
Memory (NVM): 800 KB
5G, 4G (LTE), 3G, 2G, NB-IoT, LTE-M
Embedded SIM (eSIM) chip format
MFF2 (DFN8): 6 × 5 × 0.82mm
Operating characteristics
Electrical: 1.62V to 5.5V
Operational temperature: -40ºC to +105ºC
Memory (NVM): 330 KB
5G, 4G (LTE), 3G, 2G, NB-IoT, LTE-M
Triple cut form factor
Mini-SIM (2FF): 25 × 15 × 0.71 mm
Micro-SIM (3FF): 15 × 12 × 0.71 mm
Nano-SIM (4FF): 12.3 × 8.8 × 0.71 mm
Operating characteristics
Electrical: 1.62V to 5.5V
Operational Temperature: -40ºC to +105ºC
Memory (NVM): 800 KB
5G, 4G (LTE), 3G, 2G, NB-IoT, LTE-M
Embedded SIM (eSIM) chip format
MFF2 (DFN8): 6 × 5 × 0.82mm
Operating characteristics
Electrical: 1.6V, 3V, and 5.5V
Operational temperature: -25ºC to +85ºC
Memory (NVM): 340 KB
5G, 4G (LTE), 3G, 2G, NB-IoT, LTE-M
We have additional SIM types that are available to contracted customers. To request a datasheet or more information, please contact sales.
Unlike a traditional SIM, an IoT SIM card is designed to send and receive data rather than enable voice calls. With more memory and durability than their consumer counterparts, IoT SIM cards also last longer—up to 10 years or more. They’re able to withstand environmental challenges like vibration, corrosion, and extreme temperatures.
An IoT SIM card contains a contact chip encased in plastic. The chip stores distinctive information about the device, such as credentials and carrier data, and links the device to the network. IoT SIM cards are able to operate more independently than consumer SIMs. Unlike traditional SIMs, they don’t need human interaction on the device side to be activated. Some IoT SIMs can be provisioned remotely with eUICC (embedded universal integrated circuit card) technology.
It depends on the card. Hologram's SIM cards are global and able to connect to the best networks available, anywhere in the world.
eUICC stands for embedded universal integrated circuit card. This is the technology that allows a SIM card to enable more than one subscriber profile over its lifecycle. (Carrier “subscriber profiles” indicate that a device has an account and can work on their network.) If your SIM card is eUICC-enabled, you can switch between cellular carrier profiles without ever needing to physically swap out the SIM card.
eUICC is the software that makes this possible. But for eUICC to work, you must use the right hardware — in this case, an eUICC SIM card that can support all the necessary profile management operations and additional memory.
Basically, eUICC SIMs act as a digital wallet that lets you use several different “credit cards” (or subscriber profiles), all on the same eUICC SIM card.
The eSIM is the hardware component, and the eUICC is the software component or operating system that allows for over the air (OTA) profile updates. An eSIM is ideal for IoT devices that may be exposed to harsh conditions because it can be soldered directly to the board and vacuum sealed to minimize exposure. This soldering also allows for smaller form factors with fewer pieces. If you are developing a device that needs to last, an eUICC-compatible eSIM can ensure long-term usability. Our embedded SIMs (eSIMs) are available in MFF2 (DFN8) formats.
IoT SIM cards come in all the traditional form factors: 2FF, 3FF, and 4FF. You can also choose MFF2 if you want the SIM to be embedded in your device and to include over the air (OTA) provisioning capabilities.
Every Hyper SIM includes powerful security features like Private APN, fraud detection, and device locking.
Keep a pulse on connectivity and manage deployments with our Dashboard.
Get connected and stay connected, anywhere in the world.
Get reliable coverage with our network for 500+ carriers around the world.