Back of the Hologram global IoT SIM card

Global IoT & M2M SIM Card

Global IoT SIM Card

A secure, future-proof IoT SIM card with eUICC capabilities. Access a cell network built for M2M data that works worldwide with easy activation, transparent pricing, and developer-friendly tools.

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Seamless, global coverage

Never worry about how to determine which carrier your device should connect to — our Hyper SIMs will automatically connect to the best signal available on our network.

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Self-service scalability

Order as many SIM cards as you need through our self-service store and manage connectivity on our dashboard, from one for testing to thousands for manufacturing.

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No carrier negotiations

Avoid lengthy carrier negotiations for your connectivity needs. We've sorted it out and are constantly working to improve coverage and support for our network.

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A single SIM for global IoT connectivity

Connect devices anywhere on Hologram's global network with access to LTE/4G/3G/2G technologies. With our Hyper eUICC-enabled SIMs, you’ll gain access to new connectivity partnerships without any additional carrier negotiations, integrations, or hardware swaps.

Learn about Hologram’s global network

Easy connectivity profile
management with Hyper

Hologram’s Hyper eUICC SIMs and platform give your deployment maximum flexibility and coverage. Control tailored profiles for global and localized coverage over-the-air, without needing to change hardware or SIMs.

What's Hyper?
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A global SIM for every IoT use case and device

Standard SIM card

Best for most commercial applications. Great for prototyping.

Industrial SIM card

Ruggedized for harsh environments with increased reliability and a longer life span.

Embedded SIM card

Secured physically to the device for an optimized footprint with all the benefits of Industrial SIMs.

Illustration showing the front and back of a Hologram SIM card.
Hologram Industrial SIM card
Embedded SIM (eSIM)

Sign up and try Hologram for free.

  • Free SIM
  • 1 MB/mo free
  • Connect and scale in days
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Hardware Specifications

Download the datasheet
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  • Triple-cut for Mini, Micro, and Nano SIM
  • (4FF, 3FF, 3FF)
  • Mini: 15 x 25mm
  • Micro: 12 x 15mm
  • Nano: 8.8 x 12.3mm
  • Embedded chip format
  • MFF2 (QNF8)
  • 6 x 5 x 0.7-0.82mm
  • Standard Grade operating characteristics
  • Operating temps: -25°C ~ 85°C
  • Read/write cycles: min. 500,000
  • Data retention: min. 25 yrs at 25°C
  • Industrial and Embedded operating characteristics
  • Operating temps: -40°C ~ 105°C
  • Read/write cycles: min. 200,000,000
  • Data retention: min. 25 yrs at 25°C
  • 2G/GPRS, 3G HSPDA, 4G LTE, LTE CAT-M1*
  • *Limited coverage availability for LTE CAT-M1. All formats available for eSIM (EUICC)
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